How does solvent choice, particularly CAC, influence conductivity in low-temperature curing silver paste?

How does solvent choice, particularly CAC, influence conductivity in low-temperature curing silver paste?
In low-temperature curing conductive silver pastes, solvent selection directly impacts electrical performance. Research cited in Chinese technical literature shows that pastes formulated with 2-ethoxyethyl acetate (CAC) yield the lowest sheet resistance after curing. CAC dissolves the resin carrier uniformly, allowing silver particles to pack densely with large effective contact areas during shrinkage. In contrast, butyl acetate dissolves resin poorly, causing uneven resin contraction and poor silver flake interconnection, resulting in higher sheet resistance. Optimal solvent content ranges from 4% to 15% by weight for screen printing viscosity and stability. CAC's slow evaporation also prevents premature skinning, ensuring consistent drying kinetics critical for uniform conductive network formation.